Hot plate
FTM TECHNOLOGIES
The separated case and the compact versions. They are principally designed for applications as putting in temperature, preheating, repairing circuits in CMS or traditional technology, glue drying…
ADVANTAGES:
Quick rise of temperature
effective for leadless alloy soldering resumption
High temperatures for some models
Low height, maximum 65 mm
upper cap height adaptable (allows, for example, to raise the circuit according to the heating plate's position: no other tool needed…)
Thermal security, thanks to the thermal belt , the place where we put hands is temperate
Lots of available models; possibility to build your products with custom dimensions and colours
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