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PCB plating line
direct metallizationelectroless copper

PCB plating line
PCB plating line
PCB plating line
PCB plating line
PCB plating line
PCB plating line
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Characteristics

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for PCB, direct metallization, electroless copper

Description

Direct metallization techniques are used to form a conducting layer in drilled holes before copper plating, as a substitute for electroless copper processes. SCHMID Equipment is available for all commercially available processes based on carbon, graphite, conducting polymers or Palladium. Effective treatment of micro vias in a single cycle Also suitable for roll-to-roll applications Maintenance-free fluid-jet systems for the treatment of blind vias and PTH with high aspect Ratio Fully automatic dosing based on area calculations

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Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2024
Intersolar 2024

18-21 Jun 2024 Munich (Germany) Hall Vide - Stand A2.238

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.