Coating Thickness Measurement and Quality Control
The panel measuring table offers a quick determination of the etching distribution after differential etching processes or the plating build-up of copper surfaces. The measurements are carried out fully automatically by a resistive sensor after entering the input parameters.
Subsequently, the measuring points are evaluated by a PC and converted into a 3D diagram, statistics tool included.
Precise and repeatable: fully automated measurement avoids manual handling and operation error
Fast: 100 measuring points in 3.5 min
Flexible: accommodates variable panel formats
Quality control of etching and plating processes
Process drifts are easy to spot and to correct
Reduction of yield loss by early detection
Dimensions: 1200 x 1120 x 1210 mm (L x W x H)
Weight: 200 kg
Maximum panel size: 650 x 650 mm
Measuring range:
copper thicknesses 1 µm – 120 µm
Measuring tolerances:
0.1 µm – 10 µm
Cu layer 0.1 µm – 5 µm: ± 0.075 µm
Cu layer 5 µm – 10 µm: ± < 1,5 %
5 µm – 120 µm
Cu layer 5 µm – 50 µm: ± 0.5 µm
Cu layer 50 µm – 80 µm: ± < 1 %
Cu layer 80 µm – 120 µm: ± < 2 %