Board-to-board SMT connector
Global Connector Technology
Part No: BC061
Product Spec
Pitch: 1.00mm
Profile: 4.04mm
Type: Socket
Number of Rows: Dual
Mount type: Surface mount
Number of contacts / pins: 10-30 contact
Orientation relative to PCB: Straight
Without locating peg
Material
Contact Material: Copper Alloy
Standard insulator material: Polyester LCP, UL94-V0
LCP suitable for: IR Reflow, Wave, Manual solder
Plating
All parts 50µ" Nickel underplated.
Where specified tin plating thickness 100µ"
Contact Plating: Gold Flash, Tin all over
Electrical
Current rating: 1 AMP
Operating temperature: -40°C to +105°C
Contact resistance: 20mΩ Max.
Insulation resistance: 1000 MEGAOHMS MIN.
Dielectric withstanding voltage: AC 300 V
Product Spec
Pitch: 1.00mm
Profile: 4.04mm
Type: Socket
Number of Rows: Dual
Mount type: Surface mount
Number of contacts / pins: 10-30 contact
Orientation relative to PCB: Straight
Without locating peg
Material
Contact Material: Copper Alloy
Standard insulator material: Polyester LCP, UL94-V0
LCP suitable for: IR Reflow, Wave, Manual solder
Plating
All parts 50µ" Nickel underplated.
Where specified tin plating thickness 100µ"
Contact Plating: Gold Flash, Tin all over
Electrical
Current rating: 1 AMP
Operating temperature: -40°C to +105°C
Contact resistance: 20mΩ Max.
Insulation resistance: 1000 MEGAOHMS MIN.
Dielectric withstanding voltage: AC 300 V
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