High resolution X-ray inspection device
GÖPEL electronic GmbH
Benefits of the 3D X-Ray Inspection:
Safe inspection of double-sided assembled PCBs
Reconstruction of any layers
Spatial allocation of deteted faults
Fast and user friendly test programm generation by using a single unified library
Image Capture
Complete 3D capturing can achieve test speeds of up to 40cm²/s by revolutionary GigaPixel™ technology
Reconstruction processes possible due to tomosynthesis
Simultaneous 3D x-ray inspection of top and bottom side of a double sided PCB
Optimal adaptation to future components and manufacturing requirements via Software XI-PILOT
Algorithm library suitable for all common components
Minimal times for test program generation
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