Visible phenomena are not the only ones of interest for scientific or industrial applications; uv imaging for UV laser beam alignment and diagnostic, semi-conductor mask alignment, lithography, etc are increasingly important. Our cameras sensitive in the UV and low energy X ray region use the latest solid state device technology and offer the following capabilities:
40% quantum efficiency at 200nm can be achieved with new interline chip while offering very good noise characteristics at high frame rates.
High resolution is also available with UV sensitivity with 1.3 million pixels on several CCD chips.
IEEE 1394 (Firewire), RS422, LVDS and camera link frame grabber outputs are used and also analogue video output.
