Reflow soldering oven Heller Industries
9 Heat, 3 Cool Zones, MKIII

Heller 1809 MKIII Specifications:

Overall LengthWidthHeight: 183"(465cm)/54"(137cm)/63"(160 cm)
Typical Nitrogen Consumption: 500 - 700 SCFH @ 500 PPM
Maximum Board Width Standard: 20" (50.8 cm)
Top Heating Zones: 9
Bottom Heating Zones: 9
Number of Cooling Zones Standard: 3
Temperature Range Standard: 25-350° C
Heated Length: 105" (254 cm)
Maximum Conveyor Speed: 74"/Min (188 cm/min.)

Standard Features:KIC Profiling Software,Power Width Adjustment, Auto Lubrication System, Three (3) Thermocouple Profiling, Powered Hood Lift, Signal Light Tower, KIC Profiling Software

Optional Features:High Temperature Up to 450°C, Computer Controlled Width Adjust, Center Board Support, Waterless Cooling w/ Flux Separation System, and more.

Heller Industries the recognized World Leader in Reflow Soldering Oven Technology announces a true breakthrough in Reflow soldering technology with the new Mark III series. With over 12,000 systems installed worldwide, Heller has been at the leading edge of Forced Hot Air Reflow soldering technology development since 1987.

Heller utilizes a partnership approach with their customers to develop user-initiated solutions for real world applications. The Mark III system is yet another major advancement with innovative Technologies including:
-Lead Free Certified Systems
-Maintenance Free Systems
-Lowest Cost of Ownership
-Best Return on Investment
-Integrated Cpk Software
-Local Support

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