Reflow soldering oven Heller Industries
9 Heat, 2 Cool Zones, EXL

Specifications for Heller 1809EXL:

Overall LengthWidthHeight: 183" (465 cm)54"(137cm)63"(160 cm)
Typical Nitrogen Consumption: 700 - 900 SCFH @ 500 PPM
Maximum Board Width Standard: 22" (55.8 cm)
Top Heating Zones: 9
Bottom Heating Zones: 9
Number of Cooling Zones Standard: 2
Temperature Range Standard: 25-350° C
Heated Length: 105" (254 cm)
Maximum Conveyor Speed: 74"/Min (188 cm/min.)

Standard Features:KIC Profiling Software,Power Width Adjustment, Auto Lubrication System, Three (3) Thermocouple Profiling, Powered Hood Lift, Signal Light Tower, KIC Profiling Software

Optional Features:High Temperature Up to 450°C, Computer Controlled Width Adjust, Center Board Support, Waterless Cooling w/ Flux Separation System and more.

The 1809EXL- from Heller's newest generation of reflow ovens- provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The 1809EXL features Heller's new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven-to-oven. It also provides more flexibility in board handling and robust construction.

The 1809EXL supports high-speed, high-volume throughput… at speeds up to 40 inches (one meter) per minute… while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

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