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wire bonder

Automatic wire bonder
ø: 125 µm - 500 µm


Bondjet BJ920

The Bondjet BJ920 is a nex development in heavy wire bonding. Hesse & Knipps has designed a bonder available with integrated pull and shear test, a high speed and accuracy and largest bonding area which is presently unique in the market. Advanced features available only on Bondjet BJ920 and enhanced quality control systems serve to meet your customers' requirements and greatly enhance productivity.

Advanced Features:

- E-Box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- Quality monitoring by high resolution deformation and transducer current measurement
- Program upload and download via LAN
- Flexible multi-lane handlers

Integrated Non-destructive Shear and / or Pull Test:

- Fast shear test with less stress for the connection than pull test
- Programmable pull test for each wire

Speed:

- 450 ms per wire (300 μm diameter, 8 mm loop length, 4 mm loop height)

Accuracy:

- 10 μm at 3 σ repeatibility at each position in the large work area
- 7 μm pattern recognition system accuracy

Largest Bonding Area:

- Up to 380 mm x 500 mm (15'' x 19.7'')

Bondhead Highlights:

- Maintenance-free solid state joints
- Active cutting bondhead with extended cutter lifetime
- No pusher provides better access into tight packages
- Closed loop force control, programmable from 0 to 1400 cN
- Touchdown and deformation sensor without signal delay

More specifications...

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