Fine wire wedge bonder Hesse Knipps
ø: 17.5 µm - 85.0 µm

Bondjet BJ820

The Bondjet BJ820 is the latest development of Hesse & Knipps' wedge bonding innovation, handling all challenging wire bonding applications on a single platform - RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminium or gold wire or ribbon.

High Speed Fine Pitch Wedge Bonder

Precision:

- 1 μm at 3 σ axis repeatibility at an interpolated encoder resolution of 20 nm

Largest Bonding Area

- 305 mm x 410 mm (12'' x 16,1'') work area can serve as two or mor smaller stations for efficient handling of smaller products or substrates, eliminating index time and maximizing throughput
- Enables intelligent automation of extra large products

Speed:

- Up to 7 wires per second

Quality:

- Consistant performance for the highest yields
- Realtime bond quality monitoring system
- Wear- and maintenance free piezo bondhead with solid state hinges
- Software supports control by host computer, product traceability and external statistical analysis

Small footprint, big capability:

- Integrates easily into complex production lines