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Highlight Technology Corp.
 

Flip-chip die bonder
0.4 x 0.4 - 2 x 2 mm Highlight Technology Corp.

  • flip-chip die bonder 0.4 x 0.4 - 2 x 2 mm Highlight Technology Corp.
RFID MINI LINE is included flip chip machine and transport system. One of flip chip machine is included wafer, dispense, filp chip, main bond and CCD recognize for postion compersation. The transfer system can refer to customer request.
Application
- Manufacturing and testing for contact less antenna tags and strap assembly.
- Target Production - SmartLabel (Inlay Assembly & StrapAssembly)

More specifications



standListOtherProduct www di En 2012-05-22-31