Multi-chip die bonder for flip chip and die attach
8"
Highlight Technology Corp.
- Roll-To-Roll Conveying for In-Line System.
- Integrated ACP/NCP, Flip-Chip, Pre-Bonder, Final-Bonder (Multi-Header) and
Tester into a product line.
- High Accuracy & Low Cost.
- Integrated ACP/NCP, Flip-Chip, Pre-Bonder, Final-Bonder (Multi-Header) and
Tester into a product line.
- High Accuracy & Low Cost.
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