Board-to-board connector ER8 Series
databackplaneFPC/FFC

board-to-board connector
board-to-board connector
board-to-board connector
Add to favorites
Compare this product
 

Characteristics

Type
data
Format
FPC/FFC, backplane, SMT, board-to-board
Shape
parallel, straight, right-angle
Electrical characteristics
high-speed
Material
gold
Product applications
transmission
Domain
for industrial applications, for medical applications, for automation applications
Pitch

0.8 mm
(0.031 in)

Data rate

10 b/s

Operating temperature

Max.: 125 °C
(257 °F)

Min.: -55 °C
(-67 °F)

Description

[FunctionMAX PCIe Gen.4 High Speed Transmission (16+Gbps), 0.8mm Pitch, Board-to-Board Connectors PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors 1. Pitch : 0.8mm 2. Variations : Right Angle / Parallel / Coplanar 3. Stacking Height : 7/9/10/12mm 4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos. 5. Large Guide for Easy Mating 6. Unique Contact Design for Smooth Mating 7. Samtec “Edge Rate®” Licensed Second Source In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.

Catalogs

No catalogs are available for this product.

See all of Hirose Electric Europe B.V.‘s catalogs
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.