Ion beam milling system for sample preparation
IM4000 SEM Hitachi High-Technologies Europe

The IM4000 Ion Milling system can prepare specimens for SEM imaging and analyses such as EDX and EBS in a multitude of different fields and applications such as materials, semiconductors, research and quality control. It is capable of both pin-point cross-section and flat surface ion milling. Cross-section milling provides smooth cross-section specimens for high resolution imaging of subsurface structures, with fine control of a beam-shielding mask edge for accurate cross section positioning. Flat milling provides uniform polishing of surfaces of 5 mm diameter or more with variable angle milling, to either flatten surfaces or to selectively enhance specimen surface features (relief milling).

Cross section and flat surface milling are realized via 2 removable sample stage units, allowing for convenient specimen setting and cutting edge definition using an external optical microscope.

The IM4000 features a new high-current Argon ion gun that delivers cross sectional milling rates of 300μm/hr in Silicon for dramatically reduced cross-sectioning times. The wide Argon ion beam can define sharp cross sections even on samples of dissimilar materials with different hardness that can not be cut or broken without causing material deformations or dislocations. Sensitive materials like polymers or papers can be processed using lower ion beam energies between 0 and 6kV, without need for special sample cooling.

Smooth flat milled surfaces of approximately 5mm diameter or more can be achieved within minutes by shifting the centre of the defocused ion beam from the sample rotation or swinging centre. The beam irradiation angle to the specimen surface is selectable from 0° to 90°.