Etching marking system
HITACHI Industrial Components & Equipment
New 300mm UHF-ECR Plasma Etch System.
* New Silicon Etch System for improved WtW and WiW CD control targeting the 45 and 32nm tecnology nodes.
* Improved design resulting in increased productivity and yield compared to U-7000 system.
- Yield Enhancements
Symmetrical exhaust chamber / New material chamber / Multi-waves monitor / Advanced temperature controlled electrode
- Productivity Enhancements
High speed and low particle transfer system / Replaceable process chamber
* Multi-Chamber Platform.
4 etch chambers available
