Gantry positioning system
131.4 N, max. 1.5 m/s
HIWIN
Features:
- Continuous force 131.3N for each motor
- High speed:
1.5 m/sec (upper axis),
1.2 m/sec (lower axis)
- Repeatability within 1 µm
- Resolution up to 1 µm
- Orthogonality less than 2 arc sec
Applications:
- Precision Optical Production
- Probe (PCB, Wafer, LCD, etc.)
- Wire Bonder
- Die Bonder
- Dispensing Machine
- Laser Cutting Machine
- Laser Via Machine
- Conponent Placement Machine
- Continuous force 131.3N for each motor
- High speed:
1.5 m/sec (upper axis),
1.2 m/sec (lower axis)
- Repeatability within 1 µm
- Resolution up to 1 µm
- Orthogonality less than 2 arc sec
Applications:
- Precision Optical Production
- Probe (PCB, Wafer, LCD, etc.)
- Wire Bonder
- Die Bonder
- Dispensing Machine
- Laser Cutting Machine
- Laser Via Machine
- Conponent Placement Machine
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