Ball bonder Hybond

Model 522A is a Thermosonic Ball Bonder for wires from 0.7mil (18µm) to 2.0mil (50µm) in diameter featuring HYBOND’s exclusive Soft Touch TM force ramping system. Imitated but never duplicated, the Soft Touch™ system bonds effectively with less trauma to sensitive materials like GaAs and InP. Wire control is provided by a motorized feed system which features front panel adjustment for tail length and a swing away clamp assembly which makes threading wire easier. Front panel controls include independent 1st and 2nd bond dials for U/S, Time & Force as well as a built in work stage temperature controller. The 522A has a proven track record of safe and effective wire bonding worldwide.

Other Ball Bonder models available are the 522A with option 18 (OP-18) for deep access, 522A-40 for deep access and long reach and the 626 with motorized vertical movement and capability to wedge bond, peg bond and bump bond.

Please contact us at mailus@hybond.com for more detailed information.

More specifications...