Dynamic force measuring device Hybond

The DFS-II is a system used for testing the force on the tip of the tool of a wire bonder and in some die attach bond heads as well. The DFS-II system scope displays a wave form that permits the user to establish whether there is excessive vibration, impact force or unwanted movement on the bond head as it touches down on the surface of the DFS-II Sensor. The wave form can then be printed on the on board printer for hard copy recording.

This is a perfect tool for calibration, troubleshooting, setup and verification of machine operation. Both force and time duration can be measured in actual units (force in grams and time in milliseconds) without the need of conversion charts or extra calculations. The DFS-II can be used with wire bonders of any type (automatic, semiautomatic and manual) and of any manufacture. Maximum force measured by the sensor is 500g.

Contact us at mailus@hybond.com for more information.

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