Wire bonder Hybond

Hybond designs, manufactures and sells ultrasonic and thermosonic wire bonders. Products include:
Ball Bonders: for ball bonding and bump bonding of gold wire.

Wedge Bonders: for bonding of gold, aluminum, platinum, copper and other material wires and ribbon (flat wire).

Peg Bonders: Used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine.

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