The ET839 ETX module supports industrial wide temperature (-20°C ~70°C) and low heat dissipation efficiency, making it ideal for use in fanless applications in harsh environments. The platform is powered by a 1.91GHz quad-core Intel® Atom® Processor E3845 SoC that features scalable performance that allows simple replacement or upgrade of current Bay Trail-I ETX solutions without changing the baseboard, regardless of the chassis and thermal designs.
The ET839 ETX module also gives customers with flexibility to design different carrier boards with different I/O interface, connectors and functionality specific to their needs and reduce time-to-market.
The new ET839 (95 x 114mm) supports up to 8GB of DDR3L SO-DIMM system memory. Integrated graphics enable dual independent displays via 24-bit dual channel LVDS and CRT graphics outputs with resolutions up to 1600 x 1200 and 2048 x 1536 respectively. Other interfaces and expansion provided include 4x USB, SATA II, 2x IDE, 2x COM, audio, LAN, LPT, PS/2 keyboard/mouse, as well as PCI and ISA bus.