Laser-based wafer sorter / marker
IL 200
InnoLas
The models 2000 / S / DPS / DPS-G / C / UV of the wafer marking system d IL 2000 are designed to mark various wafer materials with different diameters.
Different laser types and setups (solid-state laser, CO2 laser, UV laser etc.) are available to vield optimum process results for different wafer materilas such as Si, GaAs, Ge, GaP, InP, Sapphir, Quartz and others.
The IL 2000 provides "Deep" marking (marking depth up to 100µm) as well as "debris-free" marking (0,3 - 6µm). A powerful software package, developed in cooperation with many customers over the past 10 years, offers immediate operating solutions for most customer applications.
The model 2000 X (Die Marking System) adds specially developed Die marking software and a linear X/Y-table to the standard components of the 2000 series. These enhancements allow the 2000 X to accurately mark each die on the wafer (e.g. for processing of high-end-components).
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