Production plant for photovoltaic modules
ILS series
InnoLas
The ILS 700 laser system is a dedicated tool for use in photovoltaic laser applications as the processing of mono-crystalline and poly-crystalline silicon solar cells.
Examples for processing techniques are: laser edge isolation, LFC processes (laser fired contacts), micro via hole drilling, SiN-ablation / SiO2-ablation, downsizing, surface modification, laser scribing and surface structuring.
This gantry type machine allows the processing of different wafer formats by software program selection. Wafer sizes range from 100 x100 mm to 210 x 210 mm. There is no difference in process performance as the wafers increase in size. The automatic laser treatment of pseudo square formats is possible.
The machine can be supplied with full scale automation in various configurations as well as being in-line integrated in fully automatic manufacturing lines.
The system offers the possibility to integrate up to two laser sources in one machine for processing two wafers simultaneously or for subsequent processing with different laser sources / wave lengths. This guarantees flexibility and a very high troughput of up to 2000 wafer per hour, depending on application.
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