Wafer marking machine InnoLas

General description:

The models 3000 / S / DPS-3000 Plus of the wafer marking system IL 3000 are designed to mark 300 mm wafers.

Different laser types and setups (solid-state laser, CO2 laser, UV laser etc.) are available to yield optimum process results for different wafer materials such as Si, GaAs, Ge, GaP, InP, Sapphire, Quartz and others.

The IL 2000 provides "Deep" marking (marking depth up to 100µm) as well as "debris-free" marking (0,3 - 6µm). A powerful software package, developed in cooperation with many customers over the past 10 years, offers immediate operating solutions for most customer applications.

The basic system has two vacuum end effectors and a vacuum aligner. An enhanced "Edge-Grip" handling system is offerd as an option.

The model 3000 Plus offers the possibility to mark the frontside and the backside of a 300 mm wafer simultaneously in a single process step.

More specifications...