High speed hot-melt adhesive application unit
UFD
ITW Dynatec
With ITW Dynatec's patented Omega™ and Random Fiber patterns, the UFD -HS™ applications heads provide up to 70% adhesive savings by using less glue while maintaining if not improving bond strength.
Some companies say that they innovate, but only ITW Dynatec has the patents to prove it. (5,902,540 - 5,882,573 - 5,904,298)
* Ideal for high-speed intermittent applications
* On times down to 3.5 milliseconds
* Cycle speeds up to 6,000 per minute
* Precision control of adhesive coating
* Rapid changeover of components
* Low SCFM requirements from .05 per 25mm width
* Single screw solenoid mounting - Patent Pending
* Features long-life HS Series reverse acting module with direct or solenoid interface
* Simplified and quick-change solenoid, module or nozzle
* Solenoid can be rotated for left, right hand or center position (This feature is only available for the 1 & 2 port configurations)
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