Hot-melt adhesive application head
35 - 68 bar (500 - 1 000 psi) | BF Micro™ ITW Dynatec

The BF MICRO™ adhesive applicator is designed to give the performance of the larger Mod-Plus™ applicators but in a smaller, more compact design that simplifies installation and maintenance. Its air open/air close design provides accurate and uniform adhesive patterns and bead placement while the built-in filter helps maintain a clean nozzle orifice.

Each applicator features a Micro module with a replacable nozzle mounted to a single service block. The module also has an adjustable needle stroke to set adhesive flow for extreme accuracy. The Micro module is designed for high speed/high pressure (above 400 psi) applications where a sharp cutoff is necessary.

Each module operates with air pressure opening and closing the orifice. Standard air open/air close functionality reduces stringing and gives a clean, sharp cutoff every time throughout the life of the head, unlike spring-operated applicators which cause more stringing as the spring wears and loses tension.

High performance seals (which are also standard) improve applicator life, while the platinum sensor allows for better temperature control over conventional temperature control sensors.