DPSS infrared laser
min.65 W @ 30 kHz, >7 mJ @ 8 kHz, 1030nm | JenLas® disk IR70
JENOPTIK Laser GmbH
By expanding the product family to higher power, the JenLas® disk IR70 is the 65 W-version of Jenoptik\'s disk-laser-generation for precision material processing. The product family JenLas® disk including the JenLas® disk IR50 is already established in the market. The JenLas® disk IR70 allows users to achieve the highest quality at maximum throughput. This feature allows the user to achieve optimal laser parameters because the laser pulse length can be adjusted independently of the repetition rate. This laser features excellent beam quality in the infrared spectral range and is suitable for industrial applications in micro material processing, such as micro dicing, micro drilling and micro structuring.
The unique feature of the JenLas® disk IR70 is the decoupling of pulse length and pulse repetition rate, thus optimally adapting the required laser parameters to a given application.
Advantages:
* Laserparameter adjustable
* Disk laser design
* Passively-cooled diodes
* High pulse repetition rate
* Fast AOM power control
Benefits:
* Optimized application
* Superior beam quality over power range
* Long Life Performance
* Fast processing
* Flexible application
Applications:
* Solar cell processing
- EWT (Emitter Wrap Through)
- MWT (Metal Wrap Through)
- LFC (Laser Fired Contact)
* Wafer dicing / scribing
* Micro cutting (e.g. Stent cutting)
* Micro structuring
* Micro drilling
* Engraving
The unique feature of the JenLas® disk IR70 is the decoupling of pulse length and pulse repetition rate, thus optimally adapting the required laser parameters to a given application.
Advantages:
* Laserparameter adjustable
* Disk laser design
* Passively-cooled diodes
* High pulse repetition rate
* Fast AOM power control
Benefits:
* Optimized application
* Superior beam quality over power range
* Long Life Performance
* Fast processing
* Flexible application
Applications:
* Solar cell processing
- EWT (Emitter Wrap Through)
- MWT (Metal Wrap Through)
- LFC (Laser Fired Contact)
* Wafer dicing / scribing
* Micro cutting (e.g. Stent cutting)
* Micro structuring
* Micro drilling
* Engraving
