Chip resistor array
10 Ω - 1 kΩ | BR
KOA
eatures
• This BGA packaging resistor network device virtually eliminates channel capacitance, a primary cause of reduced system performance.
• This device eases routing design of DDR SDRAM termination.
• Higher integration of resistor elements saves overall assembly costs.
• Lead free terminal.
• High precision 1% is standard.
• BGA packaging is effective in a saving of the board space and high density mounting.
• Products meet EU-RoHS requirements. EU-RoHS reguation is not intended for Pb-glass contained in electrode, resistor and glass.
Applications
• DDR SDRAM Termintor, High Speed digital circuit.
Reference Standards
MIL-STD-202F
IEC 60115-1
JIS C 5201-1
