Multi-chip module (MCM)
KOA
Features
• Plural semiconductors in one package offers downsized system with high performance and standardization.
• Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance.
• Development with surface mounting type Hybrid IC to consolidate SMD parts
• High precision modules by function trimming.
• Less mounting problem because of the decreasing number of the terminals.
