Epoxy adhesive KB 1452 HT-2
for metalfor plasticsglass

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for plastics, glass, for ceramics
Number of components
two-component
Technical characteristics
fast curing, electrically insulating, chemical-resistant, water-resistant
Applications
for bonding, sealing, for coating, medical
Working temperature

Min.: -50 °C
(-58 °F)

Max.: 230 °C
(446 °F)

Description

Kohesi Bond KB 1452 HT-2 is a two component, room temperature curing, medical grade epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1452 HT-2 is capable of passing USP Class VI medical testing. It can withstand multiple cycles of medical sterilizations, such as autoclaving, ethylene oxide (EtO), radiation and chemical. It offers an extensive serviceable temperature range. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is castable up to 3 inches depth. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils and water. It is amber clear in color. KB 1452 HT-2 is widely used in the medical industry for making catheters, surgical instruments and endoscopes, among others. Product Highlights High glass transition temperature Resists multiple sterilization cycles Castable up to 3 inches; ideal for potting Superior chemical resistance Exceptional electrical insulation properties Capable of passing USP Class VI testing Typical Applications Bonding Sealing Coating Potting Encapsulation

Other Kohesi Bond products

TWO COMPONENT

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