• Products
  • Catalogs
  • News & Trends
  • Exhibitions

Annealing furnace VF-5100
diffusionoxidationcabinet

annealing furnace
annealing furnace
Add to favorites
Compare this product
 

Characteristics

Function
annealing, oxidation, diffusion
Configuration
cabinet
Heat source
electric
Atmosphere
controlled atmosphere
Other characteristics
high-temperature, vertical, for the electronics industry
Width

900 mm, 1,000 mm
(35.43 in, 39.37 in)

Height

2,930 mm, 3,300 mm
(115.35 in, 129.92 in)

Depth

1,850 mm, 1,950 mm
(72.83 in, 76.77 in)

Description

This large-batch, diffusion, LPCVD, vertical furnace performs 4- to 8-inch wafer ultra-high-temperature treatment. The system can be flexibly configured to enable your production line to process a variety of products. This furnace excels at power device manufacturing. Features Flexible equipment configuration is available for various production lines 50 to 150 wafers batch size can be selected 4- to 8-inch wafer size is available 4 to 8 cassette stocks Excellent temperature control from low to medium high temperature range using an LGO heater High-speed wafer transfer using a single/five wafers handling robot Equipped with an operator-friendly high performance control system This vertical furnace for 4- to 8-inch wafers flexibly meets your production line needs. You can choose the number of wafers to process from 50 to 150. You choose the heater from an LGO heater, molybdenum disilicide (MoSi2) heater and carbon heater so the furnace can be used for not only low-temperature annealing, nitride (Si3N4), polysilicon (poly Si) and other material LPCVD, oxidation and diffusion processing but also for SiC power device gate silicon oxynitriding, activation annealing and other ultra-high-temperature processing.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.