multi-product packaging line / high-speed
APAMA C2W Kulicke & Soffa

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Characteristics

  • Product applications:

    multi-product

  • Other characteristics:

    high-speed

Description

CHIP-TO-WAFER (C2W)
The APAMA Chip-to-Wafer (C2W) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).

Cost-of-Ownership Advantage

Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers.

C2W Features & Benefits:
Automation
Control
Placement Accuracy
Performance
Yield Enhancement
Adaptability
Cost-of-Ownership Advantage

Enterprise & Consumer Applications
HBM Memory Stacking
Network Routers and Switches
Servers
High-end PCs and Graphics
Smartphones and Tablets

Other Kulicke & Soffa products