multi-product packaging line / high-speed
Kulicke & Soffa
The APAMA Chip-to-Wafer (C2W) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).
Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers.
C2W Features & Benefits:
Enterprise & Consumer Applications
HBM Memory Stacking
Network Routers and Switches
High-end PCs and Graphics
Smartphones and Tablets