Conductive-fabric adhesive tape
LAIRD TECHNOLOGIES
Laird Technologies' tape products offer simple installation and are ideal for thin or low profile applications. The tape provides the flexibility of design for grounding and shielding solutions for I/O shielding panels, disk drive insulators, ground planes or circuit boards, electromedical devices and keyboard devices. The tape comes in a wide variety of materials to meet galvanic compatibility requirements.
High-Flex™ conductive fabric shielding tapes offer exceptional conformability and conductivity for dynamic flex applications. High-Flex™ tapes are constructed of Flectron™ nickel/copper metallized ripstop with a conductive pressure sensitive adhesive (PSA). This reliable tape design provides outstanding shielding performance while offering superior abrasion and corrosion resistance under high dynamic flex conditions.
High-Flex™ conductive fabric shielding tapes offer exceptional conformability and conductivity for dynamic flex applications. High-Flex™ tapes are constructed of Flectron™ nickel/copper metallized ripstop with a conductive pressure sensitive adhesive (PSA). This reliable tape design provides outstanding shielding performance while offering superior abrasion and corrosion resistance under high dynamic flex conditions.
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