Form-In-Place is an automated system for dispensing conductive elastomer industrial shielding, grounding and environmental gaskets onto metal or plastic substrates. Gaskets can be dispensed onto any conductive painted, plated or metallic surface of an electronics enclosure to protect it internally and externally from radiated interference and environmental elements.
Form-in-Place is designed to meet the increasing demand for cost effective solutions that combine EMI, grounding, environmental and galvanic performance in one product.
Molded Compartment Shields (MCS) technology for elastomeric Electromagnetic interference shielding solutions utilizes injection, transfer or compression molding technology, creating a gasket design to meet specific application requirements.
Enclosure shielding and environmental sealing performance improves
when conductive elastomer seals are molded onto substrates
instead of being mechanically attached.
This technology creates a MCS rib pattern, forming a
multi-compartment shielded enclosure. As the housing is assembled,
the MIP ribs are compressed, providing shielding.
