Based on the EP255 epoxy prepreg resin system, EP255FA is a 250°F curing, modified epoxy film adhesive that is designed for use in a variety of bonding applications such as metal to metal, metal to composite, composite to composite, composite to core or metal to core. Sandwich constructions suitable for this adhesive include aramid, aluminum and various foams. Cure temperatures as low as 235°F can be utilized, allowing the use of temperature sensitive skins and cores. Autoclave, oven or press molding operations are applicable.
