Table-Top Through-Hole Electroplating
Microvia cleaning step
Optional tinning
Uniform build-up of the copper layer
Simple operation
Through-Hole Plating for the Lab
No knowledge of chemistry required
Reliable through-hole plating is a key to success with demanding PCB prototypes. The new LPKF Contac S4 combines various galvanic and chemical processes in a compact safety housing.
Information
Galvanic through-hole plating
The connection of two or more layers is an indispensable part of PCB prototyping. The compact LPKF Contac S4 with six baths reliably performs this task: The board is routed through all stages of a bath cascade. In this way, homogeneous copper layers are produced on the walls of all through-holes, even with multilayer boards. The Contac S4 processes up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). The LPKF Contac S4 offers a final tin bath to protect the surface and improve solderability.
Improved copper layer structure
The powerful technology of the LPKF Contac S4 improves the build-up of the copper layer. Optimized anode plates and reverse pulse plating ensure uniform deposition, and activation via black hole technology, an integrated air flow and an additional process step for cleaning the through-holes provide secure connections to the surface copper without interfering interfaces. The result is uniform layer thicknesses in the holes and on the flat metal surface of the substrate.
Easy to use
The integrated touch control panel guides even inexperienced users safely through the electroplating process with an assistant and parameter management.