LPKF
Group: lpkf

Flip-chip bump inspection machine
max. 600 x 600 x 0.4 mm | LPKF FCBIS 3x Series LPKF

The 3D Flip Chip Bump Inspection System LPKF FCBIS 3x is a precise 3D measuring machine for the HighSpeed inspection of parts with microstructures, such as bumps on BGA-interposers. The surface is scanned with a confocal line sensor.

Structural design

* Input lift for Jedec trays
* Tray singulation and transport unit
* Matrix handler for interposer
* Measuring machine consisting of:
- Granite based XY-Cross Table
- Linear motors with air bearings
- HighSpeed 3D line sensors
* Sorting unit for error parts
* Output lift for Jedec trays
  • zoom



standListOtherProduct www di En 2012-05-22-31