Dielectric resin Master Bond

Master Bond's electrical and electronic grade epoxies and polyurethanes feature outstanding electrical insulation characteristics including high volume resistivity, excellent dielectric strength and low dielectric constants and dissipation factors. Because of their unusually low viscosity in combination with excellent mechanical and electrical properties, epoxies and polyurethane make superior potting and encapsulation compounds. Besides electrical insulation, they feature broad electronic compatibility. They are available as both one and two component compositions and are offered in a wide variety of viscosities, cure speeds, hardness, strengths, chemical resistance and flexibilities.
Many of the formulations combine the recognized advantageous performance characteristics of epoxy resins with those of polyurethane. They cure with minimal shrinkage to a durable high strength and tough elastomer with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals, over the exceptionally wide temperature range of -60°F to more than +250°F. Systems have been formulated to adhere well to difficult to bond substrates, others provide high optical clarity.

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