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Bonding resin / epoxy / encapsulation / for sealing
Master Bond

Characteristics

  • Type:

    epoxy

  • Applications:

    for bonding, encapsulation, for sealing

  • Other characteristics:

    single-component

Description

Master Bond EP17HT-100 is a one component epoxy system for potting, encapsulation, bonding and sealing applications with a curing temperature of 200-220°F or higher. This epoxy requires no mixing, is not premixed and frozen, feautres superb high temperature resistance, is highly dimensionally stable, conducts heat while still being electrically isolating and can be cast in thicknesses up to 1/2 inch,

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Epoxy systems