epoxy adhesive / for metal / for plastics / for ceramics
Supreme 3HTND-2CCM Master Bond

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Characteristics

  • Chemical composition:

    epoxy

  • Product applications:

    for metal, for plastics, for ceramics, for composite materials

  • Number of components:

    single-component

  • Technical characteristics:

    fast-curing, heat-cured, low outgassing, dimensionally stable, electrically insulating, thermally-conductive, chemical-resistant, water-resistant

  • Field:

    industrial, for electronics, for bonding, for sealing, for coating

Description

Primarily used for chip coating, glob top and die attach applications, Master Bond Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense types of thermal cycling. This fast curing system has a paste consistency that flows slightly while curing. Supreme 3HTND-2CCM passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and clean room applications.