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Epoxy adhesive EP3UFfor metalfor ceramicsfor plastics
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Characteristics
- Chemical composition
- epoxy
- Type of substrate
- for metal, for ceramics, for plastics, for composite materials
- Number of components
- single-component
- Technical characteristics
- low-viscosity, low outgassing, heat-cured, dimensionally stable, electrically insulating, thermally-conductive, chemical-resistant
- Applications
- industrial, for electronics, for the aerospace industry, for bonding
Description
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes and features a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K and a volume resistivity exceeding 1014 ohm-cm. EP3UF also passes NASA low outgassing tests.
Catalogs
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.