epoxy adhesive / two-component / thermally-conductive / for metal
Number of components:
The 11AOHT master bond polymer system comes with a two-component epoxy resin structure, which ensures high performance sealing and bonding, is suitable for curing at room temperature and very fast at elevated temperatures. The mix ratio of 1:1 defined by weight or volume is advantageous, while the item contains the most outstanding features for a product of its kind, including excellent electrical insulation properties, high thermal conductivity and resistance to temperatures of up to 400 degrees Fahrenheit.
The item comes in the form of a paste that can be applied without dripping or sagging, even on vertical surfaces. It is suitable for applications that involve thermal cycling. The product is also resistant to chemicals and comes with excellent adhesion properties for most ceramics, glass types and metals.