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Epoxy adhesive / two-component / high-temperature / industrial
EP21TDCHT Master Bond

Characteristics

  • Chemical composition:

    epoxy

  • Number of components:

    two-component

  • Technical characteristics:

    high-temperature

  • Domain:

    industrial

Description

EP21TDCHT-LO polymer adhesive is an epoxy bond with dual composition solution, that operates ideally at room temperature and quickly at heightened thermal condition. It is designed with a comprehensive yet trouble-free formula, with its one is to one blending ratio. After application, it provides above average shearing and peeling property, enabling a wide variety of applications with distinctly demanding specifications including intensive mechanical shock and vibration impact.

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