Epoxy adhesive / two-component / high-temperature / industrial
Number of components:
EP21TDCHT-LO polymer adhesive is an epoxy bond with dual composition solution, that operates ideally at room temperature and quickly at heightened thermal condition. It is designed with a comprehensive yet trouble-free formula, with its one is to one blending ratio. After application, it provides above average shearing and peeling property, enabling a wide variety of applications with distinctly demanding specifications including intensive mechanical shock and vibration impact.