Epoxy adhesive / two-component / electrically insolating / industrial
Number of components:
EP21LV polymer system is an epoxy solution for casting, encapsulation, coating, sealing and sticking functions. It is defined by its low viscosity property and its compliance with FDA Chapter 1, Section 175.105 that provides reliance to its application to indirect food processors. It is composed of two components that operates normally at average room temperature, with quicker response at heightened thermal condition. It allows optimal effect at a one is to one blending ratio, with high adaptability to other uses with simple modifications in the ratio formula. A 2 is to 1 fixing provides a rigid cure, and a 1 is to 2 set up enables a more responsive effect. Its composition permits stable adhesion even with intense exposure to harmful chemicals or at critical thermal atmosphere.