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Epoxy resin / encapsulation / thermal cycling
EP17HT Master Bond

Characteristics

  • Type:

    epoxy

  • Applications:

    encapsulation

  • Other characteristics:

    thermal cycling

Description

The EP17HT model, fabricated by Masterbond, is a heat cured epoxy system used for bonding, sealing, coating and encapsulating applications. This tool features complete reactiveness and it does not contain solvents or diluents. It is equipped with a specialized formulated epoxy polymer mechanism that provides an ideal balance of performance elements and high temperature service.

In addition, EP17HT offers a striking resistance to many chemicals such as acids, bases, salts, fuels, oils and many solvents, resulting to minimal shrinkage upon treatment. Moreover, the device is capable of keeping its exceptional electrical insulation qualities, even in cases of higher temperature environments.

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