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Epoxy adhesive / single-component / heat-cured / industrial
EP3HTMed Master Bond

Characteristics

  • Chemical composition:

    epoxy

  • Number of components:

    single-component

  • Technical characteristics:

    heat-cured

  • Domain:

    industrial

Description

EP3HTMed epoxy solution is a bonding system that enables versatile applications including sealing, coating, and sticking. It allows quick fix at minimum amount of time, consuming just 5 to 10 minutes at 300 degrees Fahrenheit and 20 to 30 minutes at 250 degrees Fahrenheit. It also exudes a strong shearing characteristic, with critical tolerance to autoclaving, chemical sterilants, radiation and Eto. It is a single-component concoction with independent bonding capacity. It operates infinitely at normal room thermal condition, and enables minimum cure at 250°F temperature, with a vast array of thermal adaptability that ranges between -60°F to +400°F.

Its consistency allows even and smooth spread, and requires minimum requirement during the curing process, with contact pressure only needed in heat treatment.

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