epoxy adhesive / single-component / heat-cured / industrial
Number of components:
EP3HTMed epoxy solution is a bonding system that enables versatile applications including sealing, coating, and sticking. It allows quick fix at minimum amount of time, consuming just 5 to 10 minutes at 300 degrees Fahrenheit and 20 to 30 minutes at 250 degrees Fahrenheit. It also exudes a strong shearing characteristic, with critical tolerance to autoclaving, chemical sterilants, radiation and Eto. It is a single-component concoction with independent bonding capacity. It operates infinitely at normal room thermal condition, and enables minimum cure at 250°F temperature, with a vast array of thermal adaptability that ranges between -60°F to +400°F.
Its consistency allows even and smooth spread, and requires minimum requirement during the curing process, with contact pressure only needed in heat treatment.