Dual head automatic SMT pick & place machine
Mechatronic Systems
* Placement area
* max. 400x500mm
* Component range
* from 0402 to 40x40
* min pitch 0,3mm
* BGA / µBGA
* components packgage
* tapes / sticks / trays / bulk
* Components centering
* non-contact alignment
* Placement rate
* up to 3000 cph.
* Feeder capacity
* max 80 x 8mm - automatic tape feeder
* and 2 x (300 x 200mm) - IC-tray
* with 200 x 300mm PCB size
* Resolution
* X / Y - axis - 0,008mm ( linear encoder )
* Z - axis : 0,02mm ( linear encoder )
* Rotation : 0,01° ( rotation encoder )
* Placement accuracy
* /- 0,03mm
* Dimensions and weight
* 1100 x 750 x 1300 mm / ca. 145 kg
* Supply
* 230V-50Hz -750W / 0,6 MPa - 25l/min
KEY FEATURES
* full vision automatic SMT pick and place machine
* 2 automatic pick & place heads
* automatic control of compressive force
* automatic nozzle changer (2x6 tools)
* top camerasystem for automatic fiducial
* bottom camerasystem for touchless components centering
* Gerber - and CAD editor ( all CAD-systems )
* intelligent feeder system - CAN Bus
* vision inspektion of printing accuracy of solder paste and accuracy of component placement
* operating system: Windows XP
* control panel: PC keybord / Mouse
* remote service via internet
Application area
* suitable for small and medium volume production
* qualified for pick & place of standard and fine pitch components
* incl. SOIC, PLCC. BGA , µBGA, CSP, QFN , LED
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