Lead free: - yes PCB size: - max. 180 x 120 mm Clearance for assemblies: - max. 25 mm Heating controlling: - microprozessor controlled Heat distribution: - Infrared heating element Solder temperatures: - 50 - 250 °C Solder process time: - ca. 4 - 8 min Rated power: - max. 600 W Features: - built in automatic air cooling fan Power requirements: - 220 VAC / 50Hz Dimension and weight: - 300 x 250 x 160mm / ca.18 kg
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