Reflow soldering oven
max. 600 W | RK180
Mechatronic Systems
- yes
PCB size:
- max. 180 x 120 mm
Clearance for assemblies:
- max. 25 mm
Heating controlling:
- microprozessor controlled
Heat distribution:
- Infrared heating element
Solder temperatures:
- 50 - 250 °C
Solder process time:
- ca. 4 - 8 min
Rated power:
- max. 600 W
Features:
- built in automatic air cooling fan
Power requirements:
- 220 VAC / 50Hz
Dimension and weight:
- 300 x 250 x 160mm / ca.18 kg
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