Analysis software HyperLynx DC Drop Analysis
thermal simulationdesignmodeling

analysis software
analysis software
analysis software
analysis software
analysis software
analysis software
analysis software
analysis software
analysis software
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Characteristics

Function
analysis, thermal simulation, design, modeling, co-simulation
Applications
for PCB
Type
3D

Description

Power integrity is one of the biggest problems in electronic product design. Modern ICs, digital and analog alike, require multiple supply voltages to operate. HyperLynx DC Drop provides simulation results within seconds. , Accelerates product design, reduces design respins and ensures reliability. HyperLynx DC Drop Analysis View simulation results in graphical and report format, making problems in DC power delivery quick and easy to identify. Predict temperature rise with PI/thermal co-simulation. This intuitive tool gives any member of your design team the ability to quickly and accurately analyze DC power, without the usual steep learning curve of most power analysis products. Superior Speed and Capacity Design team access to these sophisticated DC power capabilities will help companies reduce prototype spins, shorten time to market, and allow engineers to develop more reliable products. Pre- and Post-layout Analysis Model multiple DC supplies to identify areas where voltage drop and current densities exceed safe limits. Incremental Workflow - Set up and Analyze as You Need Model multiple DC supplies to identify areas where voltage drop and current densities exceed safe limits. Comprehensive Reporting All simulation results are presented in graphical report format, making power delivery problems easy to identify.

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