Combined machine: ACF tacking / ACF heat seal bonding / hot-bar reflow soldering
Miyachi Europe
These systems are designed for:
- Small to large LCD/PDP panels, sizes ranging from 1" up to 65"
- A wide variety of TAB sizes and shapes
- A wide variety of PCB sizes and shapes
This highly flexible systems can be used for 3 bonding techniques (all in one system!): ACF-Tacking, ACF Final Bonding and Hot-Bar Reflow Soldering. Some of the great features of these systems are Fine Pitch Alignment down to 30 microns. This is done by dual upwards looking cameras. A high precision pneumatic bonding head with adjustable speed and force profiles ensures easy and quick access and an ultra consistent process. For more information, please download the Emerald Series Datasheet below.
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